Controlled Atmosphere Spin-Coating System

This custom-built spin-coating system is designed to enable high-quality thin-film fabrication under a precisely regulated environment.

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Key features include:

​Dry Air or Nitrogen Atmosphere: The system delivers a continuous flow of dry air or nitrogen gas around the substrate during spin coating, ensuring a humidity-free environment, which is critical for sensitive device fabrication processes.
Adjustable Gas Flow Rate: The gas flow speed surrounding the substrate is finely controllable. This allows precise regulation of the solvent evaporation rate, directly influencing the film thickness and uniformity.
Solvent Vapour Accommodation: The system can accommodate and control solvent vapour in the chamber, providing additional modulation of the drying dynamics and enabling improved control over film morphology and quality.
Gas Flow Temperature Control: The temperature of the gas flow can be precisely adjusted, offering another degree of control over the film formation process. This feature allows tuning of crystallization and drying rates, further enhancing the reproducibility and quality of the fabricated layers.

This setup is particularly beneficial for the fabrication of nanomaterial-based and solution-processed photovoltaic devices, where atmospheric conditions play a critical role in determining device performance.